Moldex3D (CoreTech System co., Ltd.) of Chupei City, Hsinchu County at K 2019 in Düsseldorf -- K Trade Fair

Moldex3D (CoreTech System co., Ltd.)

8F-2, No. 32, Taiyuan St., 302 Chupei City, Hsinchu County
Taiwan
Telephone +886 3 5600199
Fax +886 3 5600198
mail@moldex3d.com

This company is main exhibitor of

Hall map

K 2019 hall map (Hall 13): stand A94

Fairground map

K 2019 fairground map: Hall 13

Contact

Moldex3D EMEA Team

Kelly Chen

Phone
+886-35600199

Email
kellychen@moldex3d.com

Our range of products

Product categories

Our products

Product category: Computer software services

Moldex3D eDesign Solution Package

Moldex3D eDesign offers designers an easy-to-use package to validate their designs behind the desk. The interactive interface, which facilitates the part and mold modeling and provides auto meshing technology, enables users to have efficient model preparation and also allows to work in CAD environment with no need for advanced CAD knowledge. The accurate 3D model allows you to obtain product insights, visualize flow and thermal properties, and optimize processes before physical parts are built. Moldex3D eDesign helps companies to design products with quality, reduce development costs, and shorten time to market.

1.Model a part with complete runner and cooling systems within few clicks
2.Perform 3D numerical analyses with accuracy
3.Generate reports automatically and present results in multiple ways

More Less

Product category: Computer software services

Moldex3D Professional Solution Package

On top of eDesign Package, Moldex3D Professional Package offers all types of design tools for simulation. Users are able to obtain product insights and properties, and further to optimize processes before physical parts are built.

Professional Solution Package is added with 3D Coolant CFD to fulfill requirements for RHCM and Conformal Cooling analysis to bring more benefits and value to users. Designer BLM module with Non-Matching mesh technology is also added into preprocessing interface to facilitate the part and mold modeling, and auto meshing technology enables users to work in CAD with no need for advanced CAD knowledge. Moldex3D Professional Package helps companies to enhance design reliability, reduce development costs, and shorten time to market.

1.Create a part with complete runner and cooling system within few clicks
2.Perform 3D numerical analyses with accuracy
3.Generate reports automatically and present results in customized ways

More Less

Product category: Computer software services

Moldex3D Advanced Solution Package

Moldex3D Advanced Package offers all users, from product and mold designers to advanced CAE experts, the ability to obtain the details of all types of designs, from thin-wall molded parts to complex models with fine features.

Advanced Solution Package provides 3D Coolant CFD to fulfill RHCM and Conformal Cooling requirements to bring more benefits and value to users. Designer BLM module with Non-Matching mesh technology is also added into preprocessing interface to facilitate the part and mold creation and auto meshing technology enable users to work in CAD with no need for advanced CAD knowledge.

In addition, the diversity and robustness of elements ensure the fidelity of solutions. Combining the advantages of 2.5D and 3D modeling, Moldex3D Advanced Package ensures the accurate and efficient performance for every design. Users are able to obtain product insights and properties, and further to optimize processes before physical parts are built. Moldex3D Advanced Package helps companies to design products with confidence, reduce development costs, and shorten time to market.

1.Build all kinds of models with complete runner and cooling systems
2.Perform both 2.5D and 3D numerical analyses with accuracy
3.Accurate analyses support versatile extensions for insightful process innovation
4.Generate reports automatically and present results in multiple ways

More Less

Product category: Computer software services

Moldex3D IC Packaging Package

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.

More Less

Company news

Date

Topic

Download

Jun 14, 2019

What’s New in Moldex3D R17

Using the newly released Moldex3D R17, engineers can better integrate the physical world into the digital world to accurately reflect real-world manufacturing conditions in simulations. Moldex3D R17 assists engineers to analyze dynamic characteristics of each injection molding machine, and then, the process can be optimized, further allows the gap between simulations and manufacturing to be shorter.

In R17, Moldex3D Studio plays a role as a unified platform, which enables the users to gain deeper insights and make better decisions. The improvement of Moldex3D Studio focuses on analysis functions such as History Curves, Distribution Curves, and Thickness Distribution Curves, which makes the results come out with higher effectiveness, but less memory usage, and of course, the results are more accurate.

In addition, Moldex3D R17 has breakthrough flow-fiber coupling analysis, which is important for composites applications with high concentration of fibers and high accuracy requirements. With Moldex3D R17, you can always decrease the cost of manufacturing and shorten time to market. 

What’s New in Moldex3D R17 Details:

More Less

Jun 13, 2019

Coretech (Moldex3D) Receives Prestigious Aoki Katashi Innovation Award

CoreTech System Co., Ltd. (Moldex3D; Chupei City, Taiwan), a provider of engineering simulation technology for the plastics industry, received the Aoki Katashi Innovation award from the Japan Society of Polymer Processing (JSPP; Tokyo) on June 12 in Japan. Coretech was recognized for its award-winning research—"Development of Microcellular Foam Injection Molding Simulation Technology Incorporating Bubble Nucleation."


Established in 1990, the Aoki Katashi Innovation award is named after the founder of Nissei Plastic Industrial Co., Ltd.
The researchers receiving the award were Dr. David Hsu, Product President, Moldex3D; Dan Chang, Project Manager, Moldex3D; Masato Goto, General Manager of Moldex3D Simulation Center at Saeilo Japan Inc.; Hisahiro Tanaka, Chief of Moldex3D Division at Saeilo Japan Inc.; and Dr. Hideo Akimoto, President of Akimoto Consulting. Moldex3D said that it would like to give special thanks to Professor Masahiro Ohshima at Kyoto University and Professor Kentaro Taki at Kanazawa University for providing a very important theoretical basis for this research.

“The Aoki Katashi Innovation award has been regarded as the Nobel prize in the polymer processing field. Moldex3D is very honored to receive this award as the first foreign company since 1990,” said Hsu. “The award acknowledges Moldex3D’s technology development and the effort of our partner, Saeilo Japan, who has been continuously promoting Moldex3D’s simulation technology across academia and industry sectors in Japan,” said Hsu.

“Moldex3D’s research on incorporating bubble nucleation in foam injection molding simulation has combined theory, simulation and validation, and is the most advanced technology around the world,” said Chang. “This award has encouraged us to continue advancing our simulation technology for polymer processing and helping industries solve the most complex molding problems and optimize product designs.”

The Aoki Katashi Innovation award was established in 1990 by the Japan Society of Polymer Processing, which represents more than 1500 individual members and 170 supporting companies. The award is named after the founder of Nissei Plastic Industrial Co., Ltd. and commemorates his many achievements within the plastics industry.

More Less

Jun 5, 2019

First Moldex3D Authorized Certification Center in Central Europe

Hsinchu, Taiwan – May 29, 2019 – CoreTech System Co., Ltd. (Moldex3D), the leading provider of engineering simulation solutions for the plastics industry, has named S&T Consulting Hungary Kft. (S&T) as its first Moldex3D Authorized Certification Center (MACC) in Central Europe. As a MACC, S&T will now deliver Moldex3D certification exams at its facility to recognize and validate the skills and knowledge of professionals in the use of Moldex3D solutions.

“The opening of the first MACC in Central Europe demonstrates S&T’s continued strong commitment to helping our customers stay current on the skills and knowledge necessary to master the simulation capabilities in Moldex3D software,” said Ferenc Nyirő, Industrial Digitalization Business Unit Manager, S&T Consulting Hungary. “Opening the first Authorized Certification Center here in Hungary, the heart of Europe, together with our business partner Moldex3D symbolizes that our customers are constantly at the center of everything we do.”

The Moldex3D Authorized Certification Center at S&T is located at its Budaörs headquarters, 2040 Budaörs Puskás Tivadar Street 14, and has been officially opened today. The facility is fully equipped with state-of-the-art equipment and will be launching a series of training courses built upon Moldex3D’s decades of experience in CAE plastic injection molding simulation. Upon completion of the courses, trainees will have the opportunity to take the online test to obtain the Analyst and Expert Certifications.

 “I am extremely happy to announce our new collaboration with S&T as well as the launch of the first MACC in Central Europe,” said Mr. Dannick Deng, Managing Director, Moldex3D EMEA. “We strongly believe that this new collaboration will grow our market presence in the region and ultimately help fulfill our ongoing commitment to helping companies in the manufacturing industry realize smart design and manufacturing through digitalization solutions.”

More Less

About us

Company details

About Moldex3D

CoreTech System Co., Ltd. (Moldex3D) was founded in 1995, it has provided the professional plastic injection molding simulation solution “Moldex” series for the plastic injection molding industry, and the current product “Moldex3D” is marketed worldwide.

Committed to providing the advanced technologies and solution for industrial demands, CoreTech has extended the worldwide sales and service network to provide local, immediate, and professional service. Nowadays, CoreTech presents the innovation technology, which helps customers to troubleshoot from product design to development, to optimize design pattern, to shorten time-to-market, and maximize product ROI.

More Less