Moldex3D (CoreTech System co., Ltd.) of Chupei City, Hsinchu County at K 2019 in Düsseldorf -- K Trade Fair
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Moldex3D (CoreTech System co., Ltd.)

8F-2, No. 32, Taiyuan St., 302 Chupei City, Hsinchu County
Taiwan
Telephone +886 3 5600199
Fax +886 3 5600198
mail@moldex3d.com

This company is main exhibitor of

Hall map

K 2019 hall map (Hall 13): stand A94

Fairground map

K 2019 fairground map: Hall 13

Contact

Moldex3D EMEA Team

Kelly Chen

Phone
+886-35600199

Email
kellychen@moldex3d.com

Our range of products

Product categories

Our products

Product category: Computer software services

Moldex3D eDesign Solution Package

Moldex3D eDesign offers designers an easy-to-use package to validate their designs behind the desk. The interactive interface, which facilitates the part and mold modeling and provides auto meshing technology, enables users to have efficient model preparation and also allows to work in CAD environment with no need for advanced CAD knowledge. The accurate 3D model allows you to obtain product insights, visualize flow and thermal properties, and optimize processes before physical parts are built. Moldex3D eDesign helps companies to design products with quality, reduce development costs, and shorten time to market.

1.Model a part with complete runner and cooling systems within few clicks
2.Perform 3D numerical analyses with accuracy
3.Generate reports automatically and present results in multiple ways

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Applications
Outer Packaging, Transport, Protection

Product category: Computer software services

Moldex3D Professional Solution Package

On top of eDesign Package, Moldex3D Professional Package offers all types of design tools for simulation. Users are able to obtain product insights and properties, and further to optimize processes before physical parts are built.

Professional Solution Package is added with 3D Coolant CFD to fulfill requirements for RHCM and Conformal Cooling analysis to bring more benefits and value to users. Designer BLM module with Non-Matching mesh technology is also added into preprocessing interface to facilitate the part and mold modeling, and auto meshing technology enables users to work in CAD with no need for advanced CAD knowledge. Moldex3D Professional Package helps companies to enhance design reliability, reduce development costs, and shorten time to market.

1.Create a part with complete runner and cooling system within few clicks
2.Perform 3D numerical analyses with accuracy
3.Generate reports automatically and present results in customized ways

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Product category: Computer software services

Moldex3D Advanced Solution Package

Moldex3D Advanced Package offers all users, from product and mold designers to advanced CAE experts, the ability to obtain the details of all types of designs, from thin-wall molded parts to complex models with fine features.

Advanced Solution Package provides 3D Coolant CFD to fulfill RHCM and Conformal Cooling requirements to bring more benefits and value to users. Designer BLM module with Non-Matching mesh technology is also added into preprocessing interface to facilitate the part and mold creation and auto meshing technology enable users to work in CAD with no need for advanced CAD knowledge.

In addition, the diversity and robustness of elements ensure the fidelity of solutions. Combining the advantages of 2.5D and 3D modeling, Moldex3D Advanced Package ensures the accurate and efficient performance for every design. Users are able to obtain product insights and properties, and further to optimize processes before physical parts are built. Moldex3D Advanced Package helps companies to design products with confidence, reduce development costs, and shorten time to market.

1.Build all kinds of models with complete runner and cooling systems
2.Perform both 2.5D and 3D numerical analyses with accuracy
3.Accurate analyses support versatile extensions for insightful process innovation
4.Generate reports automatically and present results in multiple ways

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Product category: Computer software services

Moldex3D IC Packaging Package

Plastic Chip Encapsulation is a molding process where chips are being capsulated with Epoxy Molding Compound (EMC) to prevent physical damage or corrosion. This process contains the interconnection between microchips and other electronics (so-called wire bonding), curing phenomenon of thermoset material, and various control management of process conditions. Due to the complexity of multiple material components, such as EMC, chip, or leadframe, and high wire density, many challenges and uncertainty have been brought to the Chip Encapsulation process. Common defects include incomplete fill, air traps, voids, wire sweep, paddle shift, package warpage, etc.

Moldex3D IC Packaging provides a complete series of molding solutions, and supports comprehensive solutions such as : Transfer Molding, Molded Underfill, Capillary Underfill (CUF), Compression Molding, Embedded Wafer Level Package (EMWLP), and No Flow Underfill (NFU) / Non Conductive Paste (NCP). Auto meshing function supports for user to complete encapsulation analysis more easily. User also can adopt advanced manual meshing for more complex component like undercut-shaped lead frame.

Moldex3D IC Packaging helps designers to fully analyze the chip encapsulation process from filling, curing, cooling, to advanced manufacturing demands, such as filler concentration, underfill encapsulation, post-molding curing, stress distribution, or structural evaluation. Significant molding problems can be predicted and solved upfront, which helps engineers enhance chip quality and prevent potential defects more efficiently. The accurate simulation also helps design optimization and well cost management.

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Applications
Switch/Connectors, E & E, IT Devices, PCBs

Target Products
Complex Geometry, Solid

About us

Company details

About Moldex3D

CoreTech System Co., Ltd. (Moldex3D) was founded in 1995, it has provided the professional plastic injection molding simulation solution “Moldex” series for the plastic injection molding industry, and the current product “Moldex3D” is marketed worldwide.

Committed to providing the advanced technologies and solution for industrial demands, CoreTech has extended the worldwide sales and service network to provide local, immediate, and professional service. Nowadays, CoreTech presents the innovation technology, which helps customers to troubleshoot from product design to development, to optimize design pattern, to shorten time-to-market, and maximize product ROI.

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