Packaging specialist SIG Combibloc (Neuhausen / Switzerland; www.sig.biz
) announced plans to invest EUR 12m to build a pilot plant at its Germany-based new Tech Center Europe in order to expedite new product and packaging development amidst growing demand for more sustainable packaging solutions.
The Swiss company says the pilot plant will complement the existing R&D Test Field & Prototype and combiLab facilities at the Tech Center, which is located close to SIGs packaging plants in Linnich, Germany.
Scheduled to be operational by the end of 2022, the plant will host state-of-the-art extrusion and finishing technology as well as advanced quality measurement systems and testing equipment. It will significantly increase serial production processability, system validation and future digital technology capacities, SIG said.