Semiconductor technology applies thermoset transfer molding


Transfer molding with a thermosetting compound and a proprietary tool is being positioned as an alternative to use of thermoplastics and standard injection molding in the production of some semiconductor devices.

Dutch firm Sencio BV (Nijmegen) says its nCapsulate technology can deliver better isotropy and thermomechanical stability than thermoplastics and standard injection molding.

Ignas van Dommelen, manager sales and marketing for Sencio, told PlasticsToday his company's transfer molding process utilizes an undisclosed thermoset compound with unique flow properties....
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