At the Fakuma 2014 trade show in Friedrichshafen, among the exhibits at the PolyOne booth was an innovative application of the company's Therma-Tech thermal management compound that looks set to take over the world of three-dimensional molded interconnect devices. In collaboration with the German companies LPKF, specialized in micro-material processing with laser structuring, and plasma treatment and coating expert Plasma Innovations GmbH, PolyOne was showing a novel process for manufacturing LED functional heat sink printed circuit board assemblies based on molded interconnect device technology.
Three-dimensional molded interconnect devices (3D-MIDs) integrate structured conductive circuit tracks on an injection molded plastic part. 3D-MIDs enable the integration of mechanical, electronic, optical and thermal functionality into injection-molded components. Offering new possibilities in design freedom, they have become ubiquitous in virtually every sector of electronics.