Partnership pursues 3D-MID applications


The Val Tech Group (Rochester, NY), which has been expanding its cleanroom space, is partnering with SelectConnect Technologies (Palatine, IL) to produce three-dimensional molded interconnect device (3D-MID) components.

"MID allows designers in the medical marketplace to integrate complex electrical and mechanical features into applications which would be difficult or impossible using the existing flat 2D technologies," James Andolina, director of business development at Val Tech told

SelectConnect Technologies uses laser direct structuring and electroless metallization to create metallic circuits and traces on 3D molded thermoplastic components that are used for a wide range of electro-mechanical applications that include sensor packaging, 3D conformal antennas, 3D circuits, active security shields and 3D-MID....
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