02/08/2014

www.gupta-verlag.de/rubber

Dispensable thermal pads with increased performance

The new materials enable manufacturers to print a layer of thermally conductive curable silicone compound in controllable thicknesses on complex and unevenly shaped substrates while ensuring good thermal management properties and reduced manufacturing costs. The new technology offers the potential to reduce material costs by 30?-?60 % by eliminating waste, says Dow Corning.The materials can be applied via standard screen or stencil print processes, or by using standard dispensing equipment. The new line encompasses four products, distinguished by varying levels of thermal conductivity with or without controlled bond line thicknesses. TC-4015 and TC-4016 offer a thermal conductivity of 1.5 W/mK, while TC-4025 and TC-4026 offer higher 2.5 W/mK
thermal conductivity.The two grades TC-4016 and TC-4026 incorporate glass beads to offer improved control over bond line thickness. All four products are said to bond well with common electronics substrates like aluminium and printed circuit boards. Plus, because they eliminate the fibreglass carrier used for conventional fabricated pads, Dow Corning's solution is said to offer lower thermal resistance, good compression and thermal management over the lifetime of a product.

www.gupta-verlag.de/rubber