Chinaplas preview: Electronics thinnovation generates demand for high-heat resins


Electronics industry trends towards miniaturization, integration, or "thinnovation" coupled with the move towards cloud computing will mean areas such as the server market will depend increasingly on reflow soldering assembly technology, which can involve peak temperatures of up to 250°C.

The required power supplies to drive servers can also easily reach 500 Volts. Consequently, plastic compounds employed in these applications will need to meet stringent electrical and thermal performance requirements, as well as superior mechanical characteristics....
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